You, Byoung HeeConner, Timothy Glenn2013-11-272013-11-272013-11Conner, T. G. (2013). Design of a mold insert alignment system for double-sided hot embossing of microfluidic devices using kinematic constraints</i> (Unpublished thesis). Texas State University-San Marcos, San Marcos, Texas.https://hdl.handle.net/10877/4892The fabrication of microfluidic devices using hot embossing has increased in complexity. Many systems are multi component systems requiring that each be aligned properly with its mating components. Double-sided hot embossing is often used to produce stackable components for these assemblies. Accurate alignment of the two mold inserts, and therefore the opposing faces of the substrate, is a critical aspect to successful assembly of multi-layered modules. A cost effective alignment system based on kinematic constraints was designed, fabricated, and tested to determine the accuracy and precision of the system. Double-sided substrates were hot embossed and characterized to evaluate the effectiveness of the design.Text51 pages1 file (.pdf)enDouble-sided micro hot embossingAlignmentKinematic constraintMicrofluidicsInterconnectionMicrofabricationMicrotechnologyMicrofluidicsMachinery, Kinematics ofMultichip modules (Microelectronics)Thesis