Song, In-HyoukPark, Taehyun2019-10-172019-10-172017-09Song, I.-H., Park, T. (2017). PMMA solution assisted room temperature bonding for PMMA-PC hybrid devices. Micromachines, 8(9): 284.2072-666Xhttps://hdl.handle.net/10877/8672Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers-PMMA to polycarbonate (PC)-to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection.Text6 pages1 file (.pdf)enmicrofluidichybrid bondingthermal bondingPMMA PC bondingEngineering TechnologyArticle© 2017 The Authors.https://doi.org/10.3390/mi8090284This work is licensed under a Creative Commons Attribution 4.0 International License.