A Study of Micro-Mechanical Punching for the Interconnection of Polymer Microfluidic Devices

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dc.contributor.advisorYou, Byoung Hee
dc.contributor.authorLek, Devanda Rex
dc.contributor.committeeMemberSriraman, Vedaraman
dc.contributor.committeeMemberKim, Yoo Jae
dc.contributor.committeeMemberSong, In-Hyouk
dc.contributor.committeeMemberKim, Namwon
dc.date.accessioned2019-02-13T17:12:36Z
dc.date.available2019-02-13T17:12:36Z
dc.date.issued2018-12
dc.description.abstractThe design of a microfluidic device can become encumbered when there is a desire to include multiple functional features. To avoid these complications one alternative is the modular design where independent devices are assembled into a system. To achieve this design structures that interconnect the modules are needed such as a micro- through-hole. Through-holes have been conventionally fabricated at the macroscale with mechanical punching. There has been a significant focus on the micro- mechanically punching of metallic foils and attention to polymeric foils is limited. In this study the generation of micro-through-holes was investigated with experiments and numerical modeling. The micro- mechanical punching process was integrated with double-sided hot embossing. A pair of mold inserts were designed with features for the fabrication of through-hole, and features for a passive alignment step. Features for mechanical punching were designed to provide five levels of punch to die clearances, and a set of pins with an aspect ratio of 1:1. The mold inserts were applied to fabricate through-holes on a sheet of thermoplastic polymer. The resulting through-holes were characterized to observe the effect of the selected clearances. The results of the experiments and the simulations showed that clearance has a significant effect on the micro-punching process. As clearance was increased it allowed more substrate material to flow into the die. When more material flowed into the die it would affect the ability to generate a fracture and its propagation through the substrate. This would have a significant influence on the success of generating a through-hole and its subsequent dimensions and the topography of the sidewalls.
dc.description.departmentMaterials Science, Engineering, and Commercialization
dc.formatText
dc.format.extent140 pages
dc.format.medium1 file (.pdf)
dc.identifier.citationLek, D. R. (2018). A study of micro-mechanical punching for the interconnection of polymer microfluidic devices (Unpublished dissertation). Texas State University, San Marcos, Texas.
dc.identifier.urihttps://hdl.handle.net/10877/7871
dc.language.isoen
dc.subjectMechanical punching
dc.subjectInterconnection
dc.subjectThrough-hole
dc.subjectHot embossing
dc.subjectMicrofluidics
dc.subject.lcshFluidic devices--Design and constructionen_US
dc.subject.lcshMicrofluidicsen_US
dc.subject.lcshPolymers--Surfacesen_US
dc.titleA Study of Micro-Mechanical Punching for the Interconnection of Polymer Microfluidic Devices
dc.typeDissertation
thesis.degree.departmentMaterials Science, Engineering, and Commercialization Program
thesis.degree.disciplineMaterials Science, Engineering, and Commercialization
thesis.degree.grantorTexas State University
thesis.degree.levelDoctoral
thesis.degree.nameDoctor of Philosophy

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