PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices
Date
2017-09
Authors
Song, In-Hyouk
Park, Taehyun
Journal Title
Journal ISSN
Volume Title
Publisher
Multidisciplinary Digital Publishing Institute
Abstract
Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers-PMMA to polycarbonate (PC)-to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection.
Description
Keywords
microfluidic, hybrid bonding, thermal bonding, PMMA PC bonding, Engineering Technology
Citation
Song, I.-H., Park, T. (2017). PMMA solution assisted room temperature bonding for PMMA-PC hybrid devices. Micromachines, 8(9): 284.
Rights
Rights Holder
© 2017 The Authors.
Rights License
This work is licensed under a Creative Commons Attribution 4.0 International License.