PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices
Multidisciplinary Digital Publishing Institute
Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers-PMMA to polycarbonate (PC)-to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection.
microfluidic, hybrid bonding, thermal bonding, PMMA PC bonding, Engineering Technology
Song, I.-H., Park, T. (2017). PMMA solution assisted room temperature bonding for PMMA-PC hybrid devices. Micromachines, 8(9): 284.
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