PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices
dc.contributor.author | Song, In-Hyouk | |
dc.contributor.author | Park, Taehyun | |
dc.date.accessioned | 2019-10-17T13:19:44Z | |
dc.date.available | 2019-10-17T13:19:44Z | |
dc.date.issued | 2017-09 | |
dc.description.abstract | Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers-PMMA to polycarbonate (PC)-to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection. | |
dc.description.department | Engineering Technology | |
dc.format | Text | |
dc.format.extent | 6 pages | |
dc.format.medium | 1 file (.pdf) | |
dc.identifier.citation | Song, I.-H., Park, T. (2017). PMMA solution assisted room temperature bonding for PMMA-PC hybrid devices. Micromachines, 8(9): 284. | |
dc.identifier.doi | https://doi.org/10.3390/mi8090284 | |
dc.identifier.issn | 2072-666X | |
dc.identifier.uri | https://hdl.handle.net/10877/8672 | |
dc.language.iso | en | |
dc.publisher | Multidisciplinary Digital Publishing Institute | |
dc.rights.holder | © 2017 The Authors. | |
dc.rights.license | This work is licensed under a Creative Commons Attribution 4.0 International License. | |
dc.source | Micromachines, 2017, Vol. 8, No. 9, Article 284. | |
dc.subject | microfluidic | |
dc.subject | hybrid bonding | |
dc.subject | thermal bonding | |
dc.subject | PMMA PC bonding | |
dc.subject | Engineering Technology | |
dc.title | PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices | |
dc.type | Article |
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