PMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices

dc.contributor.authorSong, In-Hyouk
dc.contributor.authorPark, Taehyun
dc.date.accessioned2019-10-17T13:19:44Z
dc.date.available2019-10-17T13:19:44Z
dc.date.issued2017-09
dc.description.abstractRecently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers-PMMA to polycarbonate (PC)-to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection.
dc.description.departmentEngineering Technology
dc.formatText
dc.format.extent6 pages
dc.format.medium1 file (.pdf)
dc.identifier.citationSong, I.-H., Park, T. (2017). PMMA solution assisted room temperature bonding for PMMA-PC hybrid devices. Micromachines, 8(9): 284.
dc.identifier.doihttps://doi.org/10.3390/mi8090284
dc.identifier.issn2072-666X
dc.identifier.urihttps://hdl.handle.net/10877/8672
dc.language.isoen
dc.publisherMultidisciplinary Digital Publishing Institute
dc.rights.holder© 2017 The Authors.
dc.rights.licenseThis work is licensed under a Creative Commons Attribution 4.0 International License.
dc.sourceMicromachines, 2017, Vol. 8, No. 9, Article 284.
dc.subjectmicrofluidic
dc.subjecthybrid bonding
dc.subjectthermal bonding
dc.subjectPMMA PC bonding
dc.subjectEngineering Technology
dc.titlePMMA Solution Assisted Room Temperature Bonding for PMMA⁻PC Hybrid Devices
dc.typeArticle

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